• A high quality foam pad for removing fine scratches, holograms and sanding marks.
• Designed to work with M3.02 Micro Cut or P3.01 Micro Cut & Finish.
• Unique milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier.
• Compression hardness - 10; Abrasiveness - 5
• Pad Specifications:
  • Pad Face: 6-1/4"
  • Pad Backing: 5-7/8"
  • Pad Height: 7/8"

Koch Chemie's Micro Cut Pad is a high-quality foam pad for removing fine scratches, holograms and sanding marks using M3.02 Micro Cut or P3.01 Micro Cut & Finish. The short height (7/8") of the pad creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long lasting compression hardness during polishing.The open cell structure and cell count contribute to a high-shine finish and very good cleaning factors.

The side profile of Koch Chemie pads is something you haven't seen. The second pic for the pad shows the milling edge which ensures extra flexibility for the pads, enabling them to fit around contours easier. The color matching backing material ensures process safety and accuracy. The 6 Inch size includes a center hole for heat ventilation.

Size: 6 Inch (150 mm x 23 mm)